3D Balanced-Ternary CNT Array with Dual-Function Interconnects

Overview

A three-dimensional array of photonic-ternary computing devices, arranged at the intersections of horizontal signal lines and vertical carbon-nanotube interconnects. Each vertical interconnect is dual-function: it forms part of the spatial addressing structure of the array and simultaneously conducts phonon heat flux from the interior of the array to a heat sink.

The consequence is that no die area is spent on dedicated thermal vias. Thermal management becomes structural rather than additional — the same physical element that addresses a device also cools it. This directly attacks the constraint that limits three-dimensional integration in conventional binary logic, where stacking multiplies heat density faster than it can be removed.

An individual device is addressed without a per-device access transistor, by combining spatial position within the matrix with optical and phase selection. Removing the access transistor removes the dominant area cost of a dense memory-like array.

Key Innovations

• Three-dimensional stacked array of photonic-ternary computing devices
• Vertical carbon-nanotube interconnects as combined addressing and thermal-conduction paths
• No dedicated thermal vias — heat removal is structural, not an area overhead
• Transistor-free device addressing via spatial position combined with optical selection
• Density scaling without the thermal ceiling that constrains 3D binary integration

Why It Matters

Conventional three-dimensional integration pays twice for density: once in routing and again in dedicated thermal structures. Carbon nanotubes are exceptional thermal conductors along their axis, which is what makes the dual-function interconnect possible — the addressing path is already an excellent heat pipe.

Array dimensions, via pitch, thermal flux figures, and addressing timing are shared under mutual NDA.

Disclosure

This page describes the architecture and purpose of the invention. Specific parameters — dimensions, thresholds, wavelengths, code assignments, and simulation figures — together with the complete claim set are shared under mutual NDA. Contact manish@manitlab.org to request access.

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