THATTE Patent Stack · Indian Patent Office · 2026

Patent Portfolio

Twelve complete specifications covering every layer of the photonic-ternary computing stack — from the SWCNT@MWCNT device to a microkernel operating system. Filed with the Indian Patent Office in 2026. Simulation-verified device physics.

Total Patents 12
Status Filed
Office IPO India
Verification NEGF Verified
Batch 1 · Filed 9 April 2026

The Core Stack — Device to Operating System

Thatte1–6 cover every layer of the vertical stack, from the two-nanotube device to the microkernel that runs on it.

Thatte1 · Device Filed · 2026

SWCNT@MWCNT Photonic-Ternary Device

The foundational device patent covers three core inventions: CVD fabrication of the SWCNT@MWCNT structure, the photonic-to-ternary transducer architecture, and the AC switching method. Two concentric carbon nanotubes — a metallic armchair SWCNT inside an MWCNT — separated by a van der Waals gap.

Trit encoding uses photon absorption + AC pulse polarity: photon + positive phase = +1, no photon = 0 (true zero), photon + negative phase = −1. NEGF quantum transport simulation confirms digital-grade switching current with high signal-to-noise ratio (full data under NDA).

SWCNT@MWCNTPhotonicAC Switching CVD FabricationNEGF Verified
NEGF ResultsVERIFIED
DeviceSWCNT@MWCNT
Trit +1Positive current
Trit −1Negative current
SNRDigital-grade (NDA)
Thatte2 · Logic Filed · 2026

Optical-Ternary Gate Library + Arithmetic Engine

A complete optical-ternary standard cell library for balanced ternary logic design. Gates operate on photonic trit signals from the SWCNT@MWCNT transducer. The arithmetic engine uses Kirchhoff's Current Law (KCL) at junction nodes for natural ternary computation.

GatesStandard CellsArithmetic KCLOptical-Ternary
Thatte3 · Processor Filed · 2026

Ternary Processor Architecture + T3ISA

Processor architecture designed for photonic-ternary hardware, with the T3ISA balanced ternary instruction set and execution pipeline. Instructions operate on trit-width registers with addressing modes compatible with the ternary memory architecture.

CPUT3ISAPipeline Trit RegistersExecution
View Details →
Thatte4 · Memory Filed · 2026

Memory, Interconnect + Hardware Trit-Trie Search

Covers fabric management hardware, memory bus architecture, and interconnect for the photonic-ternary system. Includes a hardware trit-trie circuit for efficient ternary search — each node branches on three trit states (−1, 0, +1), enabling O(k) operations on trit-encoded keys of depth k.

MemoryInterconnectTrit-Trie Fabric ManagementBus Architecture
View Details →
Thatte5 · Security Filed · 2026

Ternary Crypto Hardware + DFT/BIST

Cryptographic hardware primitives designed for balanced ternary arithmetic. Design-for-test (DFT) infrastructure and built-in self-test (BIST) circuits ensure manufacturing testability and runtime integrity verification of the photonic-ternary fabric.

CryptoDFTBIST Ternary PrimitivesTest Infrastructure
View Details →
Thatte6 · Software Filed · 2026

ManiT Language + Compiler + THATTEOS

The software patent covers the ManiT balanced ternary programming language, its dual-target compiler (LLVM IR for binary hosts + T3ISA for ternary hardware), and the THATTEOS photonic-ternary microkernel operating system.

The compiler is implemented in Rust (~26,800 LOC). THATTEOS is a microkernel with boot loader, scheduler, interrupt handler, process manager, privilege domains, virtual memory, IPC, and syscall interface — all written in ManiT and compiled to .t3b binaries.

ManiTCompilerTHATTEOS T3ISALLVMMicrokernel
Software Stack
LanguageManiT
CompilerRust · ~27K LOC
TargetsLLVM + T3ISA
KernelTHATTEOS
StatusCompiled + Executed
Batch 2 · Filed 8 August 2026

The Extended Architecture

Thatte7–12 cover integration, interfacing, AI acceleration, error correction, and the quantum regime — new inventions beyond the original stack, filling gaps identified once simulation evidence confirmed the core architecture.

Thatte7 · Array Filed · 2026

3D Balanced-Ternary CNT Array with Dual-Function Interconnects

A three-dimensional array of photonic-ternary devices in which the vertical carbon-nanotube interconnects are dual-function: they form the spatial addressing structure and simultaneously conduct heat out of the array interior.

No die area is spent on dedicated thermal vias — the element that addresses a device also cools it. Devices are addressed without a per-device access transistor.

3D ArrayThermal ViasInterconnect DensityIntegration
Array Structure
Topology3D matrix
Vertical viasDual-function CNT
Device accessNo transistor
Thermal pathStructural (NDA)
Thatte8 · Contactless Filed · 2026

Contactless All-Photonic Balanced Ternary Device

A variant of the foundational device with no electrical contacts at all. Three photonic inputs at distinct wavelengths replace every electrode, bonding pad, and wiring rail. Trit direction — the choice between +1 and −1 — is set by a piezoelectric shell driven optically, removing the last electrical terminal.

All-PhotonicContactlessPiezoelectric Shell Zero-ContactWavelength Control
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Thatte9 · Bridge Filed · 2026

Binary-Ternary Interface Circuit

Bidirectional translation between balanced ternary trit streams and conventional binary bus infrastructure. This is the patent that makes the rest of the stack adoptable — ternary compute can sit inside existing binary systems.

Two encodings are disclosed. A fixed-width encoding leaves one bit pattern spare, repurposed as a hardware error flag for self-checking at no latency cost. A denser encoding packs five trits into one byte, since 35 = 243 fits inside 256 — and the surplus states become a built-in framing protocol.

BridgeBinary InterfaceEncoding ProtocolInteroperability
Encodings
Fixed-width2 bits per trit
Spare patternError flag
Native5 trits per byte
Surplus statesFraming protocol
Thatte10 · NPU Filed · 2026

Ternary Neural Processing Unit

A neural accelerator whose multiply-accumulate cells are photonic-ternary devices. Network weights from {+1, 0, −1} are stored as ferroelectric polarisation and programmed optically — no electrical weight-loading interconnect.

Multiplication by a ternary weight needs no multiplier: +1 passes the trit through, −1 is a wire crossing, and 0 withholds the optical pulse entirely, leaving the device dark. Sparsity is structural — a zero weight costs no switching energy.

NPUTernary MACAI Accelerator Ferroelectric WeightsSparsity
MAC Cell
Weights{+1, 0, −1}
StorageFerroelectric
MultiplierNone required
Weight 0Dark device
Thatte11 · ECC Filed · 2026

Balanced Ternary Error Correction over GF(3)

Error-correcting circuits in which the finite-field arithmetic is largely wiring rather than active devices. Multiplication by 1 is a wire passing through; multiplication by 2 — negation in balanced ternary — is a wire crossing. Addition is current superposition followed by a threshold. On this substrate the patent builds ternary Hamming encode/decode, plus Reed–Solomon and LDPC constructions over GF(3).

ECCGF(3)Hamming Reed-SolomonLDPC
View Details →
Thatte12 · Qutrit Filed · 2026

Temperature-Modal Double-Walled Carbon Nanotube Device

The same two-nanotube structure operating in three distinct regimes, selected purely by temperature, with no structural modification. Warm, it is the classical balanced-ternary switch. Cooled, phonon scattering falls away and quantum interference emerges. Colder still, the degenerate conducting channels of the inner nanotube provide the basis for a qutrit — a native three-level quantum unit.

One fabrication process spanning classical and quantum computing, with both layers speaking the same ternary arithmetic.

QutritQuantumTemperature-Modal DWCNTThree-Level
Operating Modes
Mode 1Classical ternary
Mode 2Mesoscopic
Mode 3Qutrit
SelectorTemperature only
Filing Structure

Twelve Patents, Complete Stack

Each patent covers a layer of the photonic-ternary computing stack. Patents build on each other from device to software.

Layer Patent Title Depends On Status
1Thatte1Device — Fabrication + Transducer + SwitchingFiled
2Thatte2Logic — Gate Library + ArithmeticThatte1Filed
3Thatte3Processor — Architecture + T3ISAThatte2Filed
4Thatte4Memory — Interconnect + Trit-TrieThatte3Filed
5Thatte5Security — Crypto + DFT/BISTThatte1Filed
6Thatte6Software — ManiT + Compiler + THATTEOSThatte3Filed
7Thatte12Quantum — Temperature-Modal Qutrit DeviceThatte1Filed
Extended Architecture

Beyond the Vertical Stack

Batch 2 additions that are not stack layers but capabilities built on top of them — integration, interfacing, acceleration, and reliability.

Role Patent Title Depends On Status
IntegrationThatte73D Array — Dual-Function Thermal/Address ViasThatte1Filed
DeviceThatte8Contactless — All-Photonic Zero-Contact DeviceThatte1Filed
InterfaceThatte9Bridge — Binary-Ternary Interface CircuitThatte3Filed
AccelerationThatte10NPU — Ternary Neural Processing UnitThatte2Filed
ReliabilityThatte11ECC — Ternary Error Correction over GF(3)Thatte4Filed
Licensing & NDA

Full Technical Brief Available Under NDA

Simulation data, quantum transport results, fabrication specifications, and complete patent claims are shared under mutual NDA only.

Request Mutual NDA → Licensing Tracks
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