Patent Portfolio
Twelve complete specifications covering every layer of the photonic-ternary computing stack — from the SWCNT@MWCNT device to a microkernel operating system. Filed with the Indian Patent Office in 2026. Simulation-verified device physics.
The Core Stack — Device to Operating System
Thatte1–6 cover every layer of the vertical stack, from the two-nanotube device to the microkernel that runs on it.
SWCNT@MWCNT Photonic-Ternary Device
The foundational device patent covers three core inventions: CVD fabrication of the SWCNT@MWCNT structure, the photonic-to-ternary transducer architecture, and the AC switching method. Two concentric carbon nanotubes — a metallic armchair SWCNT inside an MWCNT — separated by a van der Waals gap.
Trit encoding uses photon absorption + AC pulse polarity: photon + positive phase = +1, no photon = 0 (true zero), photon + negative phase = −1. NEGF quantum transport simulation confirms digital-grade switching current with high signal-to-noise ratio (full data under NDA).
Optical-Ternary Gate Library + Arithmetic Engine
A complete optical-ternary standard cell library for balanced ternary logic design. Gates operate on photonic trit signals from the SWCNT@MWCNT transducer. The arithmetic engine uses Kirchhoff's Current Law (KCL) at junction nodes for natural ternary computation.
Ternary Processor Architecture + T3ISA
Processor architecture designed for photonic-ternary hardware, with the T3ISA balanced ternary instruction set and execution pipeline. Instructions operate on trit-width registers with addressing modes compatible with the ternary memory architecture.
Memory, Interconnect + Hardware Trit-Trie Search
Covers fabric management hardware, memory bus architecture, and interconnect for the photonic-ternary system. Includes a hardware trit-trie circuit for efficient ternary search — each node branches on three trit states (−1, 0, +1), enabling O(k) operations on trit-encoded keys of depth k.
Ternary Crypto Hardware + DFT/BIST
Cryptographic hardware primitives designed for balanced ternary arithmetic. Design-for-test (DFT) infrastructure and built-in self-test (BIST) circuits ensure manufacturing testability and runtime integrity verification of the photonic-ternary fabric.
ManiT Language + Compiler + THATTEOS
The software patent covers the ManiT balanced ternary programming language, its dual-target compiler (LLVM IR for binary hosts + T3ISA for ternary hardware), and the THATTEOS photonic-ternary microkernel operating system.
The compiler is implemented in Rust (~26,800 LOC). THATTEOS is a microkernel with
boot loader, scheduler, interrupt handler, process manager, privilege domains, virtual memory,
IPC, and syscall interface — all written in ManiT and compiled to .t3b binaries.
The Extended Architecture
Thatte7–12 cover integration, interfacing, AI acceleration, error correction, and the quantum regime — new inventions beyond the original stack, filling gaps identified once simulation evidence confirmed the core architecture.
3D Balanced-Ternary CNT Array with Dual-Function Interconnects
A three-dimensional array of photonic-ternary devices in which the vertical carbon-nanotube interconnects are dual-function: they form the spatial addressing structure and simultaneously conduct heat out of the array interior.
No die area is spent on dedicated thermal vias — the element that addresses a device also cools it. Devices are addressed without a per-device access transistor.
Contactless All-Photonic Balanced Ternary Device
A variant of the foundational device with no electrical contacts at all. Three photonic inputs at distinct wavelengths replace every electrode, bonding pad, and wiring rail. Trit direction — the choice between +1 and −1 — is set by a piezoelectric shell driven optically, removing the last electrical terminal.
Binary-Ternary Interface Circuit
Bidirectional translation between balanced ternary trit streams and conventional binary bus infrastructure. This is the patent that makes the rest of the stack adoptable — ternary compute can sit inside existing binary systems.
Two encodings are disclosed. A fixed-width encoding leaves one bit pattern spare, repurposed as a hardware error flag for self-checking at no latency cost. A denser encoding packs five trits into one byte, since 35 = 243 fits inside 256 — and the surplus states become a built-in framing protocol.
Ternary Neural Processing Unit
A neural accelerator whose multiply-accumulate cells are photonic-ternary devices. Network weights from {+1, 0, −1} are stored as ferroelectric polarisation and programmed optically — no electrical weight-loading interconnect.
Multiplication by a ternary weight needs no multiplier: +1 passes the trit through, −1 is a wire crossing, and 0 withholds the optical pulse entirely, leaving the device dark. Sparsity is structural — a zero weight costs no switching energy.
Balanced Ternary Error Correction over GF(3)
Error-correcting circuits in which the finite-field arithmetic is largely wiring rather than active devices. Multiplication by 1 is a wire passing through; multiplication by 2 — negation in balanced ternary — is a wire crossing. Addition is current superposition followed by a threshold. On this substrate the patent builds ternary Hamming encode/decode, plus Reed–Solomon and LDPC constructions over GF(3).
Temperature-Modal Double-Walled Carbon Nanotube Device
The same two-nanotube structure operating in three distinct regimes, selected purely by temperature, with no structural modification. Warm, it is the classical balanced-ternary switch. Cooled, phonon scattering falls away and quantum interference emerges. Colder still, the degenerate conducting channels of the inner nanotube provide the basis for a qutrit — a native three-level quantum unit.
One fabrication process spanning classical and quantum computing, with both layers speaking the same ternary arithmetic.
Twelve Patents, Complete Stack
Each patent covers a layer of the photonic-ternary computing stack. Patents build on each other from device to software.
| Layer | Patent | Title | Depends On | Status |
|---|---|---|---|---|
| 1 | Thatte1 | Device — Fabrication + Transducer + Switching | — | Filed |
| 2 | Thatte2 | Logic — Gate Library + Arithmetic | Thatte1 | Filed |
| 3 | Thatte3 | Processor — Architecture + T3ISA | Thatte2 | Filed |
| 4 | Thatte4 | Memory — Interconnect + Trit-Trie | Thatte3 | Filed |
| 5 | Thatte5 | Security — Crypto + DFT/BIST | Thatte1 | Filed |
| 6 | Thatte6 | Software — ManiT + Compiler + THATTEOS | Thatte3 | Filed |
| 7 | Thatte12 | Quantum — Temperature-Modal Qutrit Device | Thatte1 | Filed |
Beyond the Vertical Stack
Batch 2 additions that are not stack layers but capabilities built on top of them — integration, interfacing, acceleration, and reliability.
| Role | Patent | Title | Depends On | Status |
|---|---|---|---|---|
| Integration | Thatte7 | 3D Array — Dual-Function Thermal/Address Vias | Thatte1 | Filed |
| Device | Thatte8 | Contactless — All-Photonic Zero-Contact Device | Thatte1 | Filed |
| Interface | Thatte9 | Bridge — Binary-Ternary Interface Circuit | Thatte3 | Filed |
| Acceleration | Thatte10 | NPU — Ternary Neural Processing Unit | Thatte2 | Filed |
| Reliability | Thatte11 | ECC — Ternary Error Correction over GF(3) | Thatte4 | Filed |
Full Technical Brief Available Under NDA
Simulation data, quantum transport results, fabrication specifications, and complete patent claims are shared under mutual NDA only.
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